Hybrid grounding makes the grounding system exhibit different characteristics at low and high frequencies, which is necessary in wideband sensitive circuits. The capacitor has high impedance to low frequency and DC, thus avoiding the formation of ground loops between the two modules. When the DC ground and the RF ground are separated, the DC ground of each subsystem is connected to the RF ground through a capacitor of 10 to 100 nF. The two grounds should be connected at a low impedance, and the connection point should be selected at the highest flip speed ( Di/dt) The point at which the signal is present.
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